Li, Er Ping: search on Z-Library

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1

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Er-Ping Li, Xing-Chang Wei, Cangellaris, A.C., En-Xiao Liu, Yao-Jiang Zhang, D'Amore, M., Joungho Kim, Sudo, T.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2010

Language:

english

File:

PDF, 1.26 MB

english, 2010

2

A Unique Extraction of Metamaterial Parameters Based on Kramers–Kronig Relationship

Szabó, Z., Gi-Ho Park, Hedge, R., Er-Ping Li

Journal:

IEEE Transactions on Microwave Theory and Techniques

Year:

2010

Language:

english

File:

PDF, 1.31 MB

english, 2010

3

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - An integrated UHF/UWB tag antenna with radome for indoor positioning system

Li, Da, Shen, Zhong-Xiang, Li, Er-Ping

Year:

2018

Language:

english

File:

PDF, 1014 KB

english, 2018

4

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Modeling and measurement of a common-mode filter based on the 3-D transmission line structure

Li, Yong-Sheng, Swaminathan, Madhavan, Li, Er-Ping

Year:

2018

Language:

english

File:

PDF, 155 KB

english, 2018

5

Hybrid Microstrip T-Stub/Defected Ground Structure Cell for Electromagnetic Interference Bandpass Filter Design

Xun Luo, Jian-Guo Ma, Er-Ping Li, Kaixue Ma

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2011

Language:

english

File:

PDF, 1.40 MB

english, 2011

6

Microstructure, mechanical properties and fracture behavior of a new WE43 alloy

Jia, Gui-Long, Wang, Li-Ping, Feng, Yi-Cheng, Guo, Er-Jun, Chen, Yan-Hong, Wang, Chang-Liang

Journal:

Year:

2020

File:

PDF, 2.36 MB

2020

7

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Analysis and experimental validation of power distribution network with multi-slots parallel-plane structure

Li, Yan, Cao, Wen-Yuan, Zuo, Pan-Pan, Gao, Zhi-Yi, Zheng, Hong-Xing, Li, Er-Ping

Year:

2018

Language:

english

File:

PDF, 1.25 MB

english, 2018

8

[IEEE 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Hangzhou, China (2019.10.21-2019.10.23)] 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - A Novel Frequency Selective Surface Applied for EMI Suppression in Integrated Circuit Package

Zuo, Panpan, Jin, Hang, Li, Tianwu, Li, Er-Ping

Year:

2019

File:

PDF, 228 KB

2019

9

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Analysis on the effectiveness of printed circuit board edge termination using discrete components instead of implementing the 20-H rule

Montrose, M.I., Liu Enxiao,, Er-Ping Li,

Year:

2004

Language:

english

File:

PDF, 404 KB

english, 2004

10

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Analysis on the effectiveness of high speed printed circuit board edge radiated emissions based on stimulus source location

Montrose, M.I., Jin Hong-Fang,, Er-Ping Li,

Year:

2004

Language:

english

File:

PDF, 393 KB

english, 2004

11

Design of Subwavelength CMOS Compatible Plasmonic Photodetector for Nano-Electronic-Photonic Integrated Circuits

Mingxia Gu, Ping Bai, Hong Son Chu, Er-Ping Li

Journal:

IEEE Photonics Technology Letters

Year:

2012

Language:

english

File:

PDF, 562 KB

english, 2012

12

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Systematic Microwave Network Analysis for 3D Integrated Systems

Year:

2012

Language:

english

File:

PDF, 1.23 MB

english, 2012

13

Stable Narrow Linewidth 689 nm Diode Laser for the Second Stage Cooling and Trapping of Strontium Atoms

Ye, Li, Yi-Ge, Lin, Yang, Zhao, Qiang, Wang, Shao-Kai, Wang, Tao, Yang, Jian-Ping, Cao, Tian-Chu, Li, Zhan-Jun, Fang, Er-Jun, Zang

Journal:

Chinese Physics Letters

Year:

2010

Language:

english

File:

PDF, 594 KB

english, 2010

14

Electromagnetic Characteristics of Multiport TSVs Using L-2L De-Embedding Method and Shielding TSVs

Li, Yong-Sheng, Li, Yan, Min, Qiu, Wu, Ke, Liu, En-Xiao, Hao, Ran, Chen, Hong-Sheng, Zhuo, Cheng, Yin, Wen-Yan, Wang, Zhe-Yao, Yu, Hui-Chun, Li, Er-Ping

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2017

Language:

english

File:

PDF, 1.42 MB

english, 2017

15

Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling Capacitors

Yao-Jiang Zhang, Zaw Zaw Oo, Xing-Chang Wei, En-Xiao Liu, Jun Fan, Er-Ping Li

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2010

Language:

english

File:

PDF, 989 KB

english, 2010

16

Modal Analysis of Microstrip Lines Using Singular Value Decomposition Analysis of FDTD Simulations

Ahmed, Shahid, Li, Er-Ping

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2008

Language:

english

File:

PDF, 360 KB

english, 2008

17

Enhancing the Reception of Propagating Surface Plasmons Using a Nanoantenna

Mingxia Gu, Ping Bai, Er-Ping Li

Journal:

IEEE Photonics Technology Letters

Year:

2010

Language:

english

File:

PDF, 203 KB

english, 2010

18

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - EMI prediction of packages by deep neural network

Jin, Hang, Ma, Hanzhi, Li, Er-Ping

Year:

2018

Language:

english

File:

PDF, 146 KB

english, 2018

19

[IEEE 2007 IEEE International Symposium on Electromagnetic Compatibility - Honolulu, HI, USA (2007.07.9-2007.07.13)] 2007 IEEE International Symposium on Electromagnetic Compatibility - The Effects of Signal Trace's Termination on Ground Bounce and Common-Mode Radiation

Chua, Eng-Kee, Li, Er-Ping, See, Kye-Yak, Chang, Weng-Yew

Year:

2007

Language:

english

File:

PDF, 223 KB

english, 2007

20

Enhanced Photoresponse of Indium-Doped Tin Disulfide Nanosheets

Yuan, Shuo, Fan, Chao, Tian, He, Zhang, Yonghui, Zhang, Zi-Hui, Zhong, Mianzeng, Liu, Hongfei, Wang, Mengjun, Li, Er Ping

Journal:

ACS Applied Materials & Interfaces

Year:

2019

File:

PDF, 11.30 MB

2019

21

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Electrical-thermal co-simulation for through silicon via and active tier in 3-D IC

Min, Qiu, Zhou, Shi-Yun, Zhuo, Cheng, Jin, Jian-Ming, Li, Er-Ping

Year:

2018

Language:

english

File:

PDF, 144 KB

english, 2018

22

[IEEE 2012 International Symposium on Electromagnetic Compatibility - EMC EUROPE - Rome, Italy (2012.09.17-2012.09.21)] International Symposium on Electromagnetic Compatibility - EMC EUROPE - Distributed decoupling analysis on PG planes for PDN design

Luo, Guang-Xiao, Cui, Xiang, Wei, Xing-Chang, Li, Er-Ping

Year:

2012

Language:

english

File:

PDF, 817 KB

english, 2012

23

A coupled efficient and systematic full-wave time-domain macromodeling and circuit Simulation method for signal integrity analysis of high-speed interconnects

Er-Ping Li, En-Xiao Liu, Le-Wei Li, Mook-Seng Leong

Journal:

IEEE Transactions on Advanced Packaging

Year:

2004

Language:

english

File:

PDF, 409 KB

english, 2004

24

[IEEE 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010 - Fort Lauderdale, FL (2010.07.25-2010.07.30)] 2010 IEEE International Symposium on Electromagnetic Compatibility - Efficient signal and power integrity analysis by using modal decomposition and integral equations

Xing-Chang Wei,, Er-Ping Li,, En-Xiao Liu,

Year:

2010

Language:

english

File:

PDF, 490 KB

english, 2010

25

Integral Equation Technique for the Simulation of Signal Integrity and Power Integrity

Wei, Xing-Chang, Yang, De-Cao, Li, Er-Ping

Journal:

Year:

2011

Language:

english

File:

PDF, 2.28 MB

english, 2011

26

Enhanced Photoresponse of Indium-Doped Tin Disulfide Nanosheets

Yuan, Shuo, Fan, Chao, Tian, He, Zhang, Yonghui, Zhang, Zi-Hui, Zhong, Mianzeng, Liu, Hongfei, Wang, Mengjun, Li, Er Ping

Journal:

ACS Applied Materials & Interfaces

Year:

2019

Language:

english

File:

PDF, 11.30 MB

english, 2019

27

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - A novel heatsink with mushroom-type EBG structure for EMI radiation suppression

Jin, Hang, Zhang, Le, Yang, Xiao-Li, Cheng, Ping, Li, Er-Ping, Zhang, Yao-Jiang

Year:

2018

Language:

english

File:

PDF, 408 KB

english, 2018

28

[IEEE 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) - Taipei, Taiwan (2015.5.26-2015.5.29)] 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) - An asymmetric spiral-shaped DGS optimized by genetic algorithm for wideband common-mode suppression

Yong Sheng Li,, Xing Chang Wei,, Er Ping Li,

Year:

2015

Language:

english

File:

PDF, 561 KB

english, 2015

29

[IEEE 2010 International Symposium on Signals, Systems and Electronics (ISSSE 2010) - Nanjing (2010.09.17-2010.09.20)] 2010 International Symposium on Signals, Systems and Electronics - Signal integrity analysis of through-silicon via based 3D integrated circuit

Er-Ping Li,, En-Xiao Liu,

Year:

2010

Language:

english

File:

PDF, 225 KB

english, 2010

30

[IEEE 2013 IEEE International Symposium on Electromagnetic Compatibility - EMC 2013 - Denver, CO, USA (2013.08.5-2013.08.9)] 2013 IEEE International Symposium on Electromagnetic Compatibility - A differential evolution based equivalent source approach for predicting electromagnetic emissions using near-field scanning

Zhao, Wei-Jiang, Wang, Binfang, Liu, En-Xiao, Park, Hark Byeong, Park, Hyun Ho, Song, Eakhwan, Li, Er-Ping

Year:

2013

Language:

english

File:

PDF, 1.15 MB

english, 2013

31

A Semi-Analytical Approach for System-Level Electrical Modeling of Electronic Packages With Large Number of Vias

Oo, Zaw Zaw, Liu, En-Xiao, Li, Er-Ping, Wei, Xingchang, Zhang, Yaojiang, Tan, Mark, Li, Le-Wei Joshua, Vahldieck, RÜdiger

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.05 MB

english, 2008

32

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Hybrid of Scattering Matrix Method and Integral Equation used for Co-simulation of Power Integrity and EMI in Electronic Package with Large Number of P/G Vias

Oo, Zaw Zaw, Liu, En-Xiao, Wei, XingChang, Choon, Mark Tan Yew, Li, Er-Ping, Zhang, Yaojiang, Li, Le-Wei

Year:

2007

Language:

english

File:

PDF, 2.63 MB

english, 2007

33

[IEEE 2013 IEEE MTT-S International Microwave Workshop Series on RF and Wireless Technologies for Biomedical and Healthcare Applications (IMWS-BIO) - Singapore, Singapore (2013.12.9-2013.12.11)] 2013 IEEE MTT-S International Microwave Workshop Series on RF and Wireless Technologies for Biomedical and Healthcare Applications (IMWS-BIO) - Effective material parameter calculation for layered metamaterial structures and its application in antenna design

Li, Dongying, Li, Er-Ping

Year:

2013

Language:

english

File:

PDF, 1.01 MB

english, 2013

34

[IEEE 2015 IEEE International Symposium on Electromagnetic Compatibility - EMC 2015 - Dresden, Germany (2015.8.16-2015.8.22)] 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Prediction of PCB radiated emission in shielding cavity using equivalent dipole modeling

Kong, WenJie, Li, Er-Ping

Year:

2015

Language:

english

File:

PDF, 1.02 MB

english, 2015

35

[IEEE 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Reno, NV, USA (2020.7.28-2020.8.28)] 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Expedient Prediction of Eye Opening of High-Speed Links with Input Design Space Dimensionality Reduction

Ma, Hanzhi, Li, Er-Ping, Cangellaris, Andreas C., Chen, Xu

Year:

2020

File:

PDF, 197 KB

2020

36

Establishment of BMD reference databases for the diagnosis and evaluation of osteoporosis in central southern Chinese men

Xian-Ping Wu, Yan-Li Hou, Hong Zhang, Peng-Fei Shan, Qin Zhao, Xing-Zhi Cao, Ru-Chun Dai, Xiang-Hang Luo, Er-Yuan Liao

Journal:

Journal of Bone and Mineral Metabolism

Year:

2008

Language:

english

File:

PDF, 434 KB

english, 2008

37

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Hybrid Integral Equation Modeling Methods for 3D Integration

Year:

2012

Language:

english

File:

PDF, 606 KB

english, 2012

38

Emission and Susceptibility Modeling of Finite-Size Power-Ground Planes Using a Hybrid Integral Equation Method

Wei, Xing-Chang, Li, Er-Ping, Liu, En-Xiao, Chua, Eng-Kee, Oo, Zaw-Zaw, Vahldieck, R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1007 KB

english, 2008

39

[IEEE 2012 International Symposium on Electromagnetic Compatibility - EMC EUROPE - Rome, Italy (2012.09.17-2012.09.21)] International Symposium on Electromagnetic Compatibility - EMC EUROPE - Integrated analytical and numerical modeling for system level conducted/radiated immunity analysis

Gao, Xian-Ke, Yik, Hou-Meng, Lim, Boon-Hui, Zhao, Huapeng, Wang, Binfang, Li, Er-Ping

Year:

2012

Language:

english

File:

PDF, 1.50 MB

english, 2012

40

Accurate Field-Circuit Hybrid Modeling of High-Density Through Glass Via Arrays by Using Perfect Magnetic Conductors and Cylindrical Mode Expansion

Jun Li,, Xing-Chang Wei,, Er-Ping Li,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 2.29 MB

english, 2016

41

Enhanced performance of solid-state Li–O2 battery using a novel integrated architecture of gel polymer electrolyte and nanoarray cathode

Xiao, Liang, Li, Er-Wei, Yi, Jing-Yu, Meng, Wen, Deng, Bo-Hua, Liu, Jin-Ping

Journal:

Year:

2018

Language:

english

File:

PDF, 1.80 MB

english, 2018

42

[IEEE 2018 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting - Boston, MA (2018.7.8-2018.7.13)] 2018 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting - A Novel FSS Structure with Great Insensitivity to Incident Angles for High Performance Millimeter Wave Communication Radome

Li, Tian-Wu, Li, Da, Zhou, Li-Ming, Sun, Qi-Xuan, Li, Er-Ping

Year:

2018

Language:

english

File:

PDF, 778 KB

english, 2018

43

[IEEE 2019 IEEE MTT-S International Wireless Symposium (IWS) - Guangzhou, China (2019.5.19-2019.5.22)] 2019 IEEE MTT-S International Wireless Symposium (IWS) - High Performance 5G Antenna Radome Based on Absorptive Meta-surface

Zhou, Li-Ming, Li, Er-Ping, Li, Tian-Wu, Li, Da

Year:

2019

Language:

english

File:

PDF, 2.78 MB

english, 2019

44

Extraction of Al and rare earths (Ce, Gd, Sc, Y) from red mud by aerobic and anaerobic bi-stage bioleaching

Zhang, Duo-rui, Chen, Hong-rui, Nie, Zhen-yuan, Xia, Jin-lan, Li, Er-ping, Fan, Xiao-lu, Zheng, Lei

Journal:

Chemical Engineering Journal

Year:

2020

File:

PDF, 5.57 MB

2020

45

Syntheses of molecular wires containing redox center: Reversible redox property and good energy level matching with Au electrode

Er Jing Wang, Cheng Liang Wang, Qing Meng, Hong Xiang Li, Wen Ping Hu, Dao Ben Zhu

Journal:

Chinese Chemical Letters

Year:

2008

Language:

english

File:

PDF, 383 KB

english, 2008

46

[IEEE 17th International Zurich Symposium on Electromagnetic Compatibility - Singapore (2006.02.27-2006.03.3)] 2006 17th International Zurich Symposium on Electromagnetic Compatibility - Extraction of circuit parameters for transmission lines by compact 2D FDFD method

En-Xiao Liu,, Er-Ping Li,, Le-Wei Li,

Year:

2006

Language:

english

File:

PDF, 457 KB

english, 2006

47

[IEEE 2007 18th International Zurich Symposium on Electromagnetic Compatibility - Munich, Germany (2007.09.24-2007.09.28)] 2007 18th International Zurich Symposium on Electromagnetic Compatibility - A SPICE-compatible full-wave equivalent circuit model for printed circuit structure analysis

Eng-Kee Chua,, Er-Ping Li,, Kye-Yak See,, Wenyan Yin,

Year:

2007

Language:

english

File:

PDF, 230 KB

english, 2007

48

A Low-Profile Broadband Bandpass Frequency Selective Surface With Two Rapid Band Edges for 5G Near-Field Applications

Li, Da, Li, Tian-Wu, Hao, Ran, Chen, Hong-Sheng, Yin, Wen-Yan, Yu, Hui-Chun, Li, Er-Ping

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2017

Language:

english

File:

PDF, 592 KB

english, 2017

49

Thermal distribution calculations for block level placement in embedded systems

Rajendra M. Patrikar, K. Murali, Li Er Ping

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 366 KB

english, 2004

50

Plasmonic wave plate based on subwavelength nanoslits

Khoo, Eng Huat, Li, Er Ping, Crozier, Kenneth B.

Journal:

Year:

2011

Language:

english

File:

PDF, 393 KB

english, 2011

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